5th International Conference on System-Integrated Intelligence
Intelligent, flexible and connected systems in products and production
November 11th (Wed.) - 13th (Fri.), 2020: Bremen, Germany

Awards SysInt 2020


Best Paper for Jhohan Chavez Vega, Philipp Schorr, Tobias Kaufhold, Klaus Zimmermann, Lena Zentner, Valter Böhm: Influence of Elastomeric Tensioned Members on the Characteristics of Compliant Tensegrity Structures in Soft Robotic Applications


Commended Paper for Jürgen Lenz, Valerio Pelosi, Marco Taisch, Eric MacDonald, Thorsten Wuest: Data-driven Context Awareness of Smart Products in Discrete Smart Manufacturing Systems



Please note: We are monitoring the current situation regarding the CoViD-19. The safety of all participants is our main priority. Therefore we decided to postpone the SysInt conference to autumn. The new date is November 11th - 13th, 2020.

Yes, we go digital and virtual! Be part of this event and the new format! With many highlights and features you will not find on any other physical conference. You can participate, e.g. by a pre-recorded video presentation with an additional video/audio call at presentation time. You get a fully digital conference platform, with virtual and streamed physical presentations, discussion forums, some interactive content, papers, and many more.


For the 5th time since 2012, the SysInt conference provides a forum for academia and industry to disseminate their latest innovations and practices in the field of system-integrated intelligence. The focus is on integration of new, intelligent functionalities into materials, components, systems and products to enable future technologies with enhanced capabilities. Industry 4.0 and smart manufacturing solutions will feature prominently in the final programme.


We invite academia and industry to present and discuss innovative technologies and products, centered around six primary topics:


• Intelligent Systems: Enabling Technologies and Artificial Intelligence

• The Future of Manufacturing: Cyber-Physical Production and Logistic Systems

• Pervasive and Ubiquitous Computing

• Structural Health Monitoring

• Systems Engineering

• Soft Robotics and Human-Machine-Interaction


Besides the paper presentations, the conference program also offers keynote speeches from some of the discipline's most renowned scientists. Eric MacDonald Ph.D., P.E. from the Youngstown State University will give a talk regarding "3D Printing of Multi-Functional Structures". Another speech will be held by Prof. Ravinder Dahiya from the University of Glasgow about "Soft Squishy Electronic Skin".


There will be parallel tracks and guided tours through institutes, research centers and companies over the span of the conference. The program includes also a welcoming get-together in the evening of the first conference day and a dinner on the second day.