5th International Conference on System-Integrated Intelligence
Intelligent, flexible and connected systems in products and production
June 3rd (Wed.) - 5th (Fri.), 2020: Bremen, Germany

The deadline for abstract submission has been extended to December 16th, 2019.

 

For the 5th time since 2012, the SysInt conference provides a forum for academia and industry to disseminate their latest innovations and practices in the field of system-integrated intelligence. The focus is on integration of new, intelligent functionalities into materials, components, systems and products to enable future technologies with enhanced capabilities. Industry 4.0 and smart manufacturing solutions will feature prominently in the final programme.

 

We invite academia and industry to present and discuss innovative technologies and products, centered around six primary topics:

 

• Intelligent Systems: Enabling Technologies and Artificial Intelligence

• The Future of Manufacturing: Cyber-Physical Production and Logistic Systems

• Pervasive and Ubiquitous Computing

• Structural Health Monitoring

• Systems Engineering

• Soft Robotics and Human-Machine-Interaction

 

Besides the paper presentations, the conference program also offers keynote speeches from some of the discipline's most renowned scientists. Eric MacDonald Ph.D., P.E. from the Youngstown State University will give a talk regarding "3D Printing of Multi-Functional Structures". Another speech will be held by Prof. Ravinder Dahiya from the University of Glasgow about "Soft Squishy Electronic Skin".

 

There will be parallel tracks and guided tours through institutes, research centers and companies over the span of the conference. The program includes also a welcoming get-together in the evening of the first conference day and a dinner on the second day.